Date:14/11/2008 URL: http://www.thehindu.com/2008/11/14/stories/2008111455930700.htm

New Delhi

Electronic Industries Association ties up with Reed Exhibitions

Special Correspondent

NEW DELHI: The Electronic Industries Association of India (ELCINA) has entered into a three-year agreement with Reed Exhibitions India to support electronic components, materials and production equipment exhibitions across India.

Reed Exhibitions will organise for the forthcoming “Componex Nepcon India 2009” in Delhi where companies from the electronic industry, semi-conductors, power electronics, test and measurement instruments will display their products.

According to the Chief Operating Officer and Director of Reed Exhibitions India, Mandeep Singh, the tie-up with ELCINA will act as a catalyst for the electronics sector. “The expo will feature innovative solutions for the industry and encourage business opportunities for exhibitors and visitors,” he added.

Commenting on the agreement, ELCINA Secretary-General Rajoo Goel said: “The fair will prove to be an effective platform to promote Indian electronics industry. It will provide the much needed impetus to the growth of the electronics sector by being the common platform for exchanging ideas, sharing knowledge and encouraging business in this segment.”